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A solder has been designed by a team of researchers at a Slovakian technical university for high operating temperatures (350-420°C). In combination with ultrasound activation, it can be used for direct soldering without previous coating and without the use of flux. The wetting speed, the area of spread and the contact angle meet the strictest industrial criteria. Furthermore, the joints have a high shear strength. The solder is applicable in power electronics, in the energy industry and has many specific applications in progressive technologies of encapsulation such as ball grid array (BGA), flip chip technology (C4), chip-scale-package (CSP) and multi-chip-module (MCM). It is suitable for sequential or selective soldering and is designed for ultrasound, laser and combined soldering. It is a potential substitute for lead (Pb)-based solders for use at higher operating temperatures. The technology has been tested in real conditions and is ready for demonstration.
The university is looking for partners in the above industries to adopt this soldering technology under a license agreement.
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Nir-vana wants to be the first open innovation platform focus on sustainability.
According to the EU Action Plan there is a huge need of change to a more sustainable future and to collaborate and assure to achieve the SDG.
Nir-vana is the only platform integrating seamless "search and find" to the next stage of collaborating.
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